Silicon nitride insulating ring
Silicon nitride insulating ring
Silicon nitride insulating ring
Silicon nitride insulating ring
+
  • Silicon nitride insulating ring
  • Silicon nitride insulating ring
  • Silicon nitride insulating ring
  • Silicon nitride insulating ring

Silicon nitride insulating ring

The main method of silicon nitride insulating ring forming processing process and method: for different ceramic materials and different thermodynamics, physical and chemical properties of ceramic materials, traditional mechanical processing technology is continuously improved, and new processing technologies are emerging in an endless stream. Traditional processing technology has high efficiency and low dimensional accuracy. , Poor surface finish, various new electrical, thermal, chemical, laser and other processing technologies are suitable for ceramic materials with high processing precision requirements, complex shapes and specific properties (conductivity, chemical properties, etc.), but at the same time have low processing efficiency and require Conditions such as small processing shape and size In recent years, various composite processing technologies have been widely valued and applied in laboratories and engineering fields. Various composite processing technologies include: chemical mechanical processing, electrolytic grinding, ultrasonic mechanical grinding, electric spark grinding, Ultrasonic EDM composite machining, electrolytic EDM composite machining, electrolytic EDM mechanical grinding composite machining, etc.

keywords:

Aluminum oxide ceramics, silicon nitride ceramics, zirconia ceramics

Product Details

The main method of silicon nitride insulating ring forming processing process and method: for different ceramic materials and different thermodynamics, physical and chemical properties of ceramic materials, traditional mechanical processing technology is continuously improved, and new processing technologies are emerging in an endless stream. Traditional processing technology has high efficiency and low dimensional accuracy. , Poor surface finish, various new electrical, thermal, chemical, laser and other processing technologies are suitable for ceramic materials with high processing precision requirements, complex shapes and specific properties (conductivity, chemical properties, etc.), but at the same time have low processing efficiency and require Conditions such as small processing shape and size In recent years, various composite processing technologies have been widely valued and applied in laboratories and engineering fields. Various composite processing technologies include: chemical mechanical processing, electrolytic grinding, ultrasonic mechanical grinding, electric spark grinding, Ultrasonic EDM composite machining, electrolytic EDM composite machining, electrolytic EDM mechanical grinding composite machining, etc.

The preparation of high-purity and fine ceramic powder materials for heat-resistant ceramic silicon nitride is the fundamental guarantee for the quality of high-tech products. Many breakthroughs have been made in the research of high-purity, ultra-fine ceramic powder synthesis technology, powder characteristics, powder processing and shape formation, powder sintering behavior, and powder-microstructure-performance issues. Many new achievements have been made, and now the latest technology of ceramic powder preparation will be introduced. Since the theoretical density of silicon nitride (Si3N4) ceramics is low, it is much lighter than steel and engineering superalloy steel, so Si3N4? It is very suitable to replace alloy steel, with high hardness, second only to SiC; good wear resistance and good self-lubrication, which is similar to the metal surface with oil.
 

The excellent performance of new high-temperature structural ceramics silicon nitride
structural ceramics should have specific phase composition and microstructural characteristics. Product performance and use effect Taking silicon chloride ceramics as an example, the room temperature and high temperature flexural strength, fracture toughness, hardness, thermal conductivity, thermal shock resistance and oxidation increment of silicon nitride ceramics all vary with the The density increases and increases. The melting point of silicon nitride ceramics is 1900°C (under pressure). Silicon nitride ceramics are still stable when heated to 1450-1550°C in the air.

Message